The world’s first Power Architecture collaboration and
innovation facility opens in Shanghai
A localized collaborative approach to innovation
In January 2006, IBM announced the launch of the Power Application Center (PAC) in Shanghai, China. Based on IBM's leading Power Architecture™ processor technology, the PAC helps customers take full advantage of Power Architecture by making research and development, and other forms of collaborative innovation, available to customers, partners, and research institutes. It is expected to help facilitate the rapid development of the microelectronics industry in China.
On July 12, 2006 IBM opened the doors to the Power Application Center. "The Center is open to IBM and other Power.org members, where we will mutually share expertise and resources to help our clients save on technology research and development costs and accelerate the pace of their business efficiencies and innovation." said Michael J Cannon-Brookes, Vice President, IBM Business Development, China and India, at the grand opening ceremony.
The Center will focus on the industry-leading Power Architecture processor technology, helping customers apply advanced Power Architecture solutions in cooperation with Power.org members, including new Chinese research institutions. A team composed of engineers and technical experts from IBM’s Technology Collaboration Solutions unit will assist Power.org members in the expansion of the Power ecosystem in China, promotion of existing Power solutions, and development of new innovations based on the Power technology.
The Power Application Center will focus on telecomm equipment manufacturers, consumer electronics, digital media and automobile electronics industries. In addition, the Center will serve Power.org members and customers who intend to obtain licenses and adopt Power Architecture, as well as providing them with support and training of engineers and R&D personnel. Through the Center, clients and partners will get access to the extensive application and collaborative ecosystem resources of IBM and other members, thereby widening their scope for innovation. Based on the value of the Power Architecture in various applications, the Center will help clients and partners select the most suitable solution from various business models and lay a solid foundation for future development and innovation.
Power.org Member Support
The Center will inject a stream of innovation into the development of China’s semiconductor industry. The launch of the Power Application Center will undoubtedly help bring the cutting-edge technology of the Power Architecture to the China's semiconductor industry, meet its need for high-performance system design, reduce technology development time and improve chip design and manufacturing.
Several Power.org members will showcase their Power Architecture-based innovations. IBM and Freescale will provide SoC, software and systems design; Cadence, Synopsys and Mentor Graphics will provide EDA design flows; Xilinx will provide SoC solutions based on the PowerPC platform; and Genesi will offer Power workstations.
In addition, Shanghai Jiao Tong University and Ministry of Information Industry Software and Integrated Circuit Promotion Center architecture promotion center joined the alliance as China’s first non-profit organizations. The launch of the Power Application Center will further provide an ideal platform for collaborative innovation between Power.org members and Chinese business and government organizations.
Shanghai location
The PAC is located in the Pudong region of Shanghai, which is home to many foreign and domestic microelectronics enterprises. Because of its location, the PAC will be able to facilitate direct and in-depth interaction with its customers and partners to promote collaborative innovation. The development of the center will further stimulate the growth of the microelectronics industry in the neighboring areas, across the country, and ultimately throughout Asia. Its China location will help Power Architecture contribute more to the region's industry.
Published July 12, 2006